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  • 1
    Electronic Resource
    Electronic Resource
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part A: Polymer Chemistry 31 (1993), S. 2179-2185 
    ISSN: 0887-624X
    Keywords: poly(aryl ether amide) ; amide-activated nucleophilic displacement ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: A general method for the preparation of poly(aryl ether amide)s has been developed where the generation of an aryl ether linkage is the polymer-forming reaction. The amide linkage was found to be sufficiently electron-withdrawing to activate halo-substituents towards nucleophilic aromatic substitution analogous to conventional activating groups (i.e., sulfone, ketone, etc.). Model reactions demonstrated that the amide-activated displacement occurred with high selectivity in near quantitative yield and was judged suitable as a polymer-forming reaction. Appropriately fluoro-substituted amides were prepared and subjected to displacement polymerization with bisphenoxides in a N-methyl-2-pyrrolidone (NMP)/N-cyclohexyl-2-pyrrolidone (CHP) solvent mixture. High molecular weight polymers with glass transition temperatures in the 200-225°C range were obtained. © 1993 John Wiley & Sons, Inc.
    Additional Material: 1 Ill.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 21 (1994), S. 665-672 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: Layers of the oxides FeO, Fe3O4, Fe2O3, Cr2O3 and Al2O3 were prepared by evaporation of the corresponding metal layers onto a preoxidized Si substrate and oxidation at elevated temperature. The oxidation was conducted under thermodynamically well-defined conditions so that the pure oxide phases noted were obtained. The oxide layer thickness was calculated from the thickness of the initial metal film, which was determined by chemical analysis and from the frequency change of a quartz crystal upon evaporaton. Auger electron spectroscopy depth profiles of the oxide layers were measured during Ar+ sputtering, and the sputter time necessary to reach the interface oxide/substrate was determined. The determination of this sputter time was not very exact, because the transition from oxide to substrate in the profile was rather gradual, owing to the roughness and crystalline character of the oxide layers that causes inhomogeneous sputtering. However, from the sputter time, oxide thickness and ion beam current, the sputter rates were obtained for the oxides noted (in nm μA-1 cm-2 min-1) and were compared to the sputter rate of amorphous Ta2O5, which is generally used as the sputter reference standard. Considerable differences were found. The results will lead to more reliable determinations of oxide scale thicknesses by sputtering.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
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