ISSN:
1573-4803
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract In the present work, diffusion between vanadium and Cu-20 at.% Ga alloy and that between vanadium and Cu-20 at.% Si alloy were studied. An intermetallic compound, V3Ga, is formed easily by the selective diffusion of gallium from the Cu-Ga alloy to the vanadium. V5Si3 and V3Si are formed also by the selective diffusion of silicon from the Cu-Si alloy to the vanadium. Copper scarcely dissolves either in V3Ga, V5Si3 or V3Si. Copper is not effective for enhancing the formation of V3Si unlike the case of V3Ga. A large super-conducting critical current density, J c, is obtained in the V3Ga formed at temperatures below 700° C while a much smaller J c is obtained in the V3Si formed at 800° C. Changes in J c due to the heat-treatment can be interpreted by the grain growth of the compounds.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00550198
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