ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Electroplating behavior of Bi 〈sub〉2〈/sub〉Te 〈sub〉3〈/sub〉 and thermoelectric properties of the electroplated Bi 〈sub〉2〈/sub〉Te 〈sub〉3〈/sub〉 films were investigated for nanowire application. Composition, microstructure, and thermoelectric properties of the electroplated Bi-Te films were strongly dependent upon composition of the electroplating solutions and plating current density. While the power factor of the Bi 〈sub〉2〈/sub〉Te 〈sub〉3〈/sub〉 film plated at a current density of 1×10〈sup〉-4〈/sup〉 A/cm〈sup〉2〈/sup〉 was 1.75×10〈sup〉-4〈/sup〉 W/K〈sup〉2〈/sup〉-m, the film formed at 5×10〈sup〉-4〈/sup〉 A/cm〈sup〉2〈/sup〉 exhibited the value of 3.5×10〈sup〉-4〈/sup〉 W/K〈sup〉2〈/sup〉-m. Substantial pore filling was achieved with electrodeposition of Bi 〈sub〉2〈/sub〉Te 〈sub〉3〈/sub〉for the alumina template with 200 nm pores
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/08/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.449-452.377.pdf
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