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  • 1
    Electronic Resource
    Electronic Resource
    Hoboken, NJ : Wiley-Blackwell
    Advances in Polymer Technology 15 (1996), S. 1-16 
    ISSN: 0730-6679
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: For design, optimization, and process-engineering applications of mold-cooling computer-aided engineering (CAE) technology, it is important that the software is sensitive to changes in cooling channel design for different materials and process conditions. In the present work, an attempt has been made to perform a detailed and rigorous verification to check for these design sensitivities from the CAE analysis. For four design and polymer material combinations, both molding and simulation trials were performed. C-COOL™ v. 3.0 mold cooling simulation software was used for the simulation trials. For each of these trials, measurements were taken for part planar-surface temperature distributions using infrared thermography, and for mold-wall temperatures at specific locations in the cavity using thermocouples. These experimental data have been compared with the predicted values and a favorable agreement has been observed for sensitivities most critical for design purposes. © 1996 John Wiley & Sons, Inc.
    Additional Material: 11 Ill.
    Type of Medium: Electronic Resource
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